Semiconductor Packaging: Materials Interaction and Reliability

Semiconductor Packaging: Materials Interaction and Reliability

简介:

本书重点介绍了半导体制造中的一个重要步骤-封装组装和测试。它涵盖了材料属性的基础知识,并解释了如何确定哪些行为对包装性能很重要。

英文简介:

The book focuses on an important step in semiconductor manufacturing - package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance.

书名
Semiconductor Packaging: Materials Interaction and Reliability
译名
半导体封装:材料相互作用和可靠性
语言
英语
年份
2012
页数
208页
大小
8.15 MB
标签
  • 半导体
  • 下载
    pdf iconSemiconductor Packaging: Materials Interaction and Reliability.pdf
    密码
    65536

    最后更新:2025-04-12 23:55:28

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