Semiconductor Packaging: Materials Interaction and Reliability

简介:
本书重点介绍了半导体制造中的一个重要步骤-封装组装和测试。它涵盖了材料属性的基础知识,并解释了如何确定哪些行为对包装性能很重要。
英文简介:
The book focuses on an important step in semiconductor manufacturing - package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance.
- 书名
- Semiconductor Packaging: Materials Interaction and Reliability
- 译名
- 半导体封装:材料相互作用和可靠性
- 语言
- 英语
- 年份
- 2012
- 页数
- 208页
- 大小
- 8.15 MB
- 标签
- 半导体
- 下载
Semiconductor Packaging: Materials Interaction and Reliability.pdf
- 密码
- 65536
最后更新:2025-04-12 23:55:28
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